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APL5708R
Low IQ, Low Dropout 700mA Fixed Voltage Regulator
Features
* * * * * * * * * * * * * * Low Quiescent Current : 60A (No load) Low Dropout Voltage : 700mV (@700mA) Very low Shutdown Current : < 0.5uA Fixed Output Voltage : 1.5V ~ 3.5V by step 0.1V increment Stable with 2.2F Output Capacitor Stable with Aluminum, Tantalum or Ceramic Capacitors . No Protection Diodes Needed Built in Thermal Protection Built in Current Limit Protection Controlled Short Circuit Current : 50mA Fast Transient Response Short Setting Time SOT-223 Package Lead Free Available (RoHS Compliant)
General Description
The APL5708R series are micropower, low dropout linear regulators, which operate from 2.7V to 6V input voltage and deliver up to 700mA. Typical dropout voltage is only 700mV at 700mA loading. Designed for using in battery-powered system, the low 60A quiescent current makes it an ideal choice. Design with an internal P-channel MOSFET pass transistor, the APL5708R maintain a low supply current, independent of the load current and dropout voltage. Other features include thermal-shutdown protection, current limit protection to ensure specified output current and controlled short-circuit current. The APL5708R regulators come in a miniature SOT-223 package.
Pin Configuration
T A B is V O U T
Applications
* * * * * 5V to 3.3~3.5V Linear Regulators 3.3V to 1.5~2.5V Linear Regulators CD-R/W, DVD Player LAN Card, ADSL/Cable Modem Computers
1 2 3
GND
V OUT
V IN
SOT-223 (Top View) APL5708R
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2005 1 www.anpec.com.tw
APL5708R
Ordering and Marking Information
APL5708R L e a d F re e C o d e H a n d lin g C o d e Tem p. Range P ackage C ode V o lta g e C o d e P ackage C ode V : S O T -2 2 3 Tem p. Range C : 0 to 7 0 C H a n d lin g C o d e TR : Tape & Reel V o lta g e C o d e : 1 5 : 1 .5 V ~ 3 5 : 3 .5 V L e a d F re e C o d e L : L e a d F re e D e vc ie
B la n k : O rig in a l D e vic e
A P L 5 7 0 8 R -1 5 V :
A PL5708R XXXXX15
XXXXX
- D a te C o d e
;
1 5 - 1 .5 V
Notes: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature.
Pin Description
PIN Name GND VOUT VIN I/O Description Ground pins of the circuitry. Output pin of the regulator. Supply voltage input.
No. 1 2 3
O I
Absolute Maximum Ratings
Symbol VIN, VOUT RTH,JA PD TJ Parameter Input Voltage or Out Voltage Thermal Resistance - Junction to Ambient Power Dissipation Operating Junction Temperature Control Section Power Transistor TSTG TL Storage Temperature Range Lead Temperature (Soldering, 10 second) Rating 6 135 Internally Limited 0 to 125 0 to 150 -65 to +150 260 C C Unit V C/W W C
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APL5708R
Electrical Characteristics
Unless otherwise noted these specifications apply over full temperature, CIN=1F, COUT=2.2F, TJ=0 to 125C. Typical values refer to TJ=25C. Symbol VIN VOUT ILIMIT Parameter Input Voltage Output Voltage Circuit Current Limit VOUT+1.0V< VCC<6.0V, 0mA< IOUT < VIN=VOUT+1V VOUT=0V VIN=VOUT+1V VOUT+1V< VCC<6.0V, IOUT=1mA VIN =VOUT+1V, 0mA< IOUT < IMAX VIN= VOUT+1V, IOUT=1mA-700mA in 1s
(Note1)
Test Conditions
APL5708R Min. 2.7
VOUT -2%
Typ.
Max. 6
Unit V V mA mA mA
VOUT VOUT +2% 900 50
ISHORT Short Current IOUT Load Current REGLINE Line Regulation REGLOAD Load Regulation Load Transient
700 1 25 150 1.1 0.9 0.8 0.7 55 60 450 150 30 10 40 250 1.3 1.0 0.9 0.8 100 500
mV mV mV
VDROP Dropout Voltage PSRR Ripple Rejection IQ OTS
1.5VVOUT<2.0V 2.0VVOUT<2.5V IOUT =700mA 2.5VVOUT<3V 3VVOUT 3.5V F1kHz, 1Vpp at VIN = VOUT+1.0V No load IOUT=700mA
V
45
dB A C C ppm/C F 1 Ohm
Quiescent Current Over Temperature Shutdown
Over Temperature Hysteresis Shutdown Hysteresis TC COUT Output Voltage Temperature Coefficient Output Capacitor ESR 0.01
50 2.2 0.1
Note1: Dropout voltage definition: VIN - VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT +1V.
Application Circuit
IN P U T 2 .7 V to 6 V V IN AP L5708R GND C OUT 2 .2 F V OUT VO UT
C IN 1 F
1
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APL5708R
Typical Characteristics
Quiescent Current vs. Input Voltage
450
APL5708R-33
Quiescent Current vs. Output Current
500 450
APL5708R-33
IOUT=0mA
400
Quiescent Current (A)
Quiescent Current (A)
350 300 250 200 150 100 50 0 0 1 2 3 4 5 6
400 350 300 250 200 150 100 50 0 0
VIN=5V
100
200
300
400
500
600
700
Input Voltage (V)
Output Current (mA)
Output Voltage vs. Input Voltage
3.5
APL5708R-33
Output Voltage vs. Temperature
3.31 3.31
APL5708R-33
IOUT=0mA
3
Output Voltage (V)
Output Voltage (V)
2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6
3.30 3.30 3.29 3.29 3.28 3.28 -40 -20 0 20 40 60 80 100 120 140
Input Voltage (V)
Temperature (C )
Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2005
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APL5708R
Typical Characteristics
Dropout Voltage vs. Output Current
800 700
APL5708R-33
PSRR vs. Frequency
+ 0
APL5708R-33
vIN =5V
-1 IOUT =50mA 0 -2 0
Dropout Voltage (mV)
600
PSRR (dB)
500 400 300 200 100 0 0 100 200 300 400 500 600 700
-3 0 -4 0 -5 0 -6 0 -7 0 -8 0 2 0
5 10 20 000
50 1 2 0kk
5 1k 2k k00
5k 10 20 0 0k 0k
Output Current (mA)
Frequency (HZ)
Load-Transient Response
APL5708R-33
Line-Transient Response
APL5708R-33
Output Voltage (100mV/div)
Output Voltage (10mV/div)
VOUT
VIN=4.5V~5.5V COUT=1F IOUT=10mA
VOUT
COUT=2.2F IOUT=1mA~700mA
Time (100s/div)
Time (200s/div)
Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2005
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APL5708R
Typical Characteristics
Region of Stable ESR vs. Output Current
1
APL5708R-33
Region of Stable ESR vs. Output Current
1
APL5708R-33
VOUT=3.3V
VOUT=1.5V
COUT ESR ()
COUT ESR ()
0.1
0.1
0.01
stable untested
0.01
stable untested
0.001 0 100 200 300 400 500 600 700
0.001 0 100 200 300 400 500 600 700
Output Current (mA)
Output Current (mA)
Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2005
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APL5708R
Package Information
SOT-223( Reference JEDEC Registration SOT-223)
D B1 A c a
H
E L K e e1 b A1
B
Dim A A1 B B1 c D E e e1 H L K Min. 1.50 0.02 0.60 2.90 0.28 6.30 3.30
Millimeters Max. 1.80 0.08 0.80 3.10 0.32 6.70 3.70 2.3 BSC 4.6 BSC 6.70 0.91 1.50 0 13 7.30 1.10 2.00 10 0.26 0.04 0.06 0 Min. 0.06 0.02 0.11 0.01 0.25 0.13
Inches Max. 0.07 0.03 0.12 0.01 0.26 0.15 0.09 BSC 0.18 BSC 0.29 0.04 0.08 10 13
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APL5708R
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
TP
(IR/Convection or VPR Reflow)
tp C ritical Z one T L to T P
R am p-up
T e m p e ra tu re
TL T sm ax
tL
T sm in R am p-down ts Preheat
25
t 25 C to Peak
T im e
Classification Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds
6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface.
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APL5708R
Classification Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process - Package Peak Reflow Tem peratures 3 3 Package Thickness Volum e m m Volum e m m <350 350 <2.5 m m 240 +0/-5C 225 +0/-5C 2.5 m m 225 +0/-5C 225 +0/-5C Table 2. Pb-free Process - Package Classification Reflow Tem peratures 3 3 3 Package Thickness Volum e mm Volum e mm Volum e mm <350 350-2000 >2000 <1.6 m m 260 +0C* 260 +0C* 260 +0C* 1.6 m m - 2.5 m m 260 +0C* 250 +0C* 245 +0C* 2.5 m m 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and including the stated classification tem perature (this m eans Peak reflow tem perature +0C. For exam ple 260C+0C) at the rated MSL level.
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245C,5 SEC 1000 Hrs Bias @ 125C 168 Hrs, 100% RH, 121C -65C ~ 150C, 200 Cycles
Carrier Tape & Reel Dimensions
t E Po P P1 D
F W
Bo
Ao
D1
Ko
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APL5708R
Carrier Tape & Reel Dimensions (Cont.)
T2
J C A B
T1
Application
A 3301
B 621.5 D
C 12.75 0.15 D1
J 2 0.6 Po
T1 12.4 +0.2 P1
T2 2 0.2 Ao
W 12 0.3 Bo
P 8 0.1 Ko
E 1.75 0.1 t
SOT-223
F
5.5 0.05 1.5+ 0.1
1.5+ 0.1 4.0 0.1 2.0 0.05 6.9 0.1 7.5 0.1
2.1 0.1 0.30.05
(mm)
Cover Tape Dimensions
Application SOT- 223 Carrier Width 12 Cover Tape Width 9.3 Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2005
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